CVE-2023-21671

Published Nov 7, 2023

Last updated a year ago

Overview

Description
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
Source
product-security@qualcomm.com
NVD status
Modified
Products
fastconnect_6700_firmware, fastconnect_6900_firmware, qca6391_firmware, qcm6490_firmware, qcs6490_firmware, qsm8350_firmware, video_collaboration_vc3_platform_firmware, sd888_firmware, sm7315_firmware, sm7325p_firmware, snapdragon_778g_5g_mobile_platform_firmware, snapdragon_778g\+_5g_mobile_platform_firmware, snapdragon_780g_5g_mobile_platform_firmware, snapdragon_782g_mobile_platform_firmware, snapdragon_7c\+_gen_3_compute_firmware, snapdragon_888_5g_mobile_platform_firmware, snapdragon_888\+_5g_mobile_platform__firmware, wcd9370_firmware, wcd9375_firmware, wcd9380_firmware, wcd9385_firmware, wcn6740_firmware, wsa8830_firmware, wsa8835_firmware

Risk scores

CVSS 3.1

Type
Primary
Base score
7.8
Impact score
5.9
Exploitability score
1.8
Vector string
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Severity
HIGH

Weaknesses

product-security@qualcomm.com
CWE-20
nvd@nist.gov
NVD-CWE-noinfo

Social media

Hype score
Not currently trending

Configurations