CVE-2026-21385

Published Mar 2, 2026

Last updated 3 hours ago

Exploit knownCVSS high 7.8

Overview

Description
Memory corruption while using alignments for memory allocation.
Source
product-security@qualcomm.com
NVD status
Undergoing Analysis

Risk scores

CVSS 3.1

Type
Secondary
Base score
7.8
Impact score
5.9
Exploitability score
1.8
Vector string
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Severity
HIGH

Known exploits

Data from CISA

Vulnerability name
Qualcomm Multiple Chipsets Memory Corruption Vulnerability
Exploit added on
Mar 3, 2026
Exploit action due
Mar 24, 2026
Required action
Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.

Weaknesses

product-security@qualcomm.com
CWE-190

Social media

Hype score
Not currently trending

References

Sources include official advisories and independent security research.